Nanomaterials PVD reactor
- Layer engineering / deposition systems
- Chamber with a diameter of 500 mm and a target diameter of 150 mm
PVD (physical vapor deposition – magnetron sputtering) – this process uses the phenomena of metal/alloy evaporation, sputtering, ionization of gases and crystallization of specific phases from plasma on a selected substrate. Coatings are applied on a cold substrate or heated to a temperature of 200-500 °C. The substrate-coating connection is adhesive.