Nanomaterials Thin insulator layers



In the course of a number of semiconductor projects, CBRTP has developed the competence and know-how to produce thin insulator layers on any substrate. The type of technique to be applied varies with the type of substrate, requiring consultation and evaluation of materials before proceeding with the process.



02Deposition methods

– atomic layer deposition (ALD)
– magnetron sputtering (PVD)
– vapour phase deposition (LPCVD, CVD, PECVD)

  • materials and their composites: Al2O3, MgO, TiN, AlN
  • on any surface which is stable at 200°C, depending on the insulator type (100–550°C), with any surface development to a maximum within 200x200x600 mm3
  • processed at 100–550°C
  • superficial and volumetric doping of layers is possible
  • production of structures with gradient changes in composition is possible
  • layer crystallisation degree control is possible


  • photovoltaic cells
  • sensors
  • transparent electronics
  • optical filters
  • structures that modify the hardness and adhesion of all material types
  • corrosion protection
  • anti-reflective layers
  • hydro- and oleophobic layers
  • reduction of sorption in nanoporous systems

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