Nanomaterials Thin metal layers



CBRTP has the instruments and scientific and engineering personnel acquired through nearly 10 years of experience in the delivery of research and industrial projects in many process engineering areas and scientific disciplines. We are well versed in the design of layered and multi-layered systems, and produce custom thin layers and multi-layered coatings of metals on any substrate. The type of technique to be applied varies with the type of substrate, requiring consultation and evaluation of materials before proceeding with the process.


02Deposition method

magnetron and electrochemical

Magnetron sputtering (PVD)

  • deposited materials: Al, Cu, Cr, Ni, Fe, Al/Ag, Au, Ti
  • type of material and substrate geometry: flat surfaces; type of material – any, substrate dimensions – up to 200 mm in diameter
  • additional excitation sources: resistive elements operating from 50°C to 450°C

Electrochemical deposition

  • using this electrochemical method, we can deposit layers of Cu, Ni, Cr and other metals of virtually any thickness on open conductive substrates
  • using a non-electrical method, we deposit Ni layers up to several micrometres thick on any substrate (and also in narrow passages) made of tool steel


  • corrosion protection of metallic surfaces
  • production of electrical contacts
  • modification of surface hardness and roughness
  • production of interfaces and reflective layers

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