Nanomaterials ALD reactors

Surface engineering / deposition systems

Reaction chambers that enable working with elements from 20 mm up to 600 mm in size. The temperature range of the deposition process is 50-500°C. In the reaction chamber, a coating of a given material is deposited on the selected substrate, layer by layer. We have experience in the deposition of layers/ coatings of:

• toxides (e.g. Al2O3, TiO2, ZrO2, ZnO, Cu2O, CuO, MgO)
• nitrides (e.g. AlN, TiN, CrN)
• sulphides (e.g. ZnS, SnSx)
• carbides (e.g. Al4C3, SiC)
• metals (e.g. Pt, Cu, Pd)
• polymers
• biocompatible layers (implants)
• sandwich-type layers (photovoltaics)
• doped materials (e.g. AZO, MZO, FZO

Application areas of layers obtained with the ALD technique:

• microelectronics: sensors, solar panels, memories, fuel cells
• passivation layers, wear-resistant layers, nano-wires, anti-corrosion layers
• usable coatings, for example on porous materials
• biocidal coatings

ALD (atomic layer deposition) – a technique based on the alternate introducing of reagents (called precursors) to the reaction chamber.